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自愿执行标准覆盖范围:从3D原件设计到电力设备系统

发布时间: 2018-01-31 11:05:29   审校:睿智  

为了传达标准在日常生活中发挥的重要作用,美国国家标准协会(ANSI)发布了在全球及国家标准范围内不同标准的简要,其中大多数标准是由ANSI成员及ANSI认可的标准制定组织所制定。以下选择其中最新的两个:

一、电力设备系统

电力设备和系统可以指广义的设备,包括开关设备、变压器和旋转机械,这些设备必须按照工业和制造商的标准和公差可靠和安全地运行。

ANSI/NETA ATS-2017电力设备和系统验收测试标准确保测试的电气设备和系统正常运行、符合适用的标准和制造商的公差且按照设计规范进行安装。这些规范涵盖了可用于评估电力设备与系统的初始通电和最终验收的现场测试和检测。

美国国家电气测试协会(NETA)是ANSI成员和被ANSI认可的标准制定组织,发布了ANSI / NETA ATS-2017,以帮助电力设备和系统进行预通电和启动。这种类型的测试可以发现运输过程中造成的任何损坏,检查以确保按照设计进行安装且所有的部件都作为系统的一部分或者个体互相连接、正常工作。

NETA是一个为电气测试行业提供服务的机构,它提供认证第三方电气测试公司、认证电气测试技术人员、制定美国国家标准、举办动力测试—电气维护和安全会议以及出版NETA World技术期刊等服务。

二、3D组件的设计及组装程序实施

根据电子工业联合会(IPC)的统计,随着电子移动设备市场的持续增长,人们对设备小型化的需求及高性能的期望将会越来越高。因此,下一代3D组装面临多实施方面的挑战,由于技术的复杂性,对锻造厂、外包半导体组装和测试(OSAT)提供商以及原始设计制作商(ODM)的工艺专业知识也提出了要求。

IPC-7091标准,3D组件的设计及组装程序实施旨在为设计、开发、使用3D封装半导体原件或是考虑3D封装实施的人群提供有益且实用的信息。

3D半导体封装可以包括多个模具元件,其中包括一些均质元件和一些非均质元件。 封装也可能包括多个独立式被动SMT元件,其中一些是表面贴装元件,另一些是集成(嵌入)元件。

本标准由电子工业协会(IPC)制定,IPC是ANSI成员及被ANSI认可的标准制定组织。IPC是行业协会,其宗旨是规范电子设备及电子配件的组装及生产要求。

 

Voluntary Standards Cover the Spectrum: from Design of 3D Components to Electrical Power Equipment Systems

In an effort to communicate the vital role that standards play in daily life, the American National Standards Institute (ANSI) publishes snapshots of the diverse standards initiatives undertaken in the global and national standards arena, many of which are performed by ANSI members and ANSI-accredited standards developers. Two of the latest selections follow:

Electrical Power Equipment Systems

Electrical power equipment and systems can refer to a wide spectrum of equipment, including switchgear, transformers, and rotating machinery, which must operate reliably and safely in conformance with industry and manufacturer standards and tolerances.

ANSI/NETA ATS-2017, Standard for Acceptance Testing Specifications for Electrical Power Equipment and Systems, assures that tested electrical equipment and systems are operational, are within applicable standards and manufacturers’ tolerances, and are installed in accordance with design specifications. These specifications cover the suggested field tests and inspections that are available to assess the suitability for initial energization and final acceptance of electrical power equipment and systems.
The InterNational Electrical Testing Association (NETA), an ANSI member and accredited standards developer, published ANSI/NETA ATS-2017 to assist in the pre-energization inspection and startup of power equipment and systems. This type of testing identifies any damage that occurred during shipping, checks to assure that installation occurred in accordance with designs, and that all components are connected and function as part of a system as well as individually.
NETA is an organization that serves the electrical testing industry by offering accreditation of third-party electrical testing firms, certifying electrical testing technicians, producing of American National Standards, hosting PowerTest-Electrical Maintenance and Safety Conference, and publishing the NETA World technical journal.

Design and Assembly Process Implementation of 3D Components

According to the Association Connecting Electronics Industries (IPC), as the mobile electronics markets continue to see significant growth, there will be an increasing demand for product miniaturization and higher product performance expectation. To that end, the next generation of 3D assembly has many implementation challenges, since the technology is complex and requires process expertise that may require foundries, outsourced semiconductor assembly and test (OSAT) providers, and original design manufacturers (ODM).

The standard IPC-7091, Design and Assembly Process Implementation of 3D Components, intends to provide useful and practical information to those who are designing, developing, or using 3D-packaged semiconductor components or those who are considering 3D package implementation.

The 3D semiconductor package may include multiple die elements; some homogeneous and some heterogeneous. The package may also include several discrete passive SMT devices, some of which are surface mounted and some of which are integrated (embedded) within the components.

The standard was developed by IPC, the Association Connecting Electronics Industries, an ANSI member and accredited standards developer. IPC is a trade association whose aim is to standardize the assembly and production requirements of electronic equipment and assemblies.


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